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1 ? fn4315.16 hin202e, HIN206E, hin207e, hin208e, hin211e, hin213e, hin232e 15kv, esd-protected, +5v powered, rs-232 transmitters/receivers the hin202e, HIN206E, hin207e, hin208e, hin211e, hin213e, hin232e family of rs-232 transmitters/receivers interface circuits meet all ela high-speed rs-232e and v.28 specifications, and are par ticularly suited for those applications where 12v is not available. a redesigned transmitter circuit improves data rate and slew rate, which makes this suitable for isdn and high speed modems. the transmitter outputs and receiver inputs are protected to 15kv esd (electrostatic discharge). they require a single +5v power supply and feature o nboard charge pump voltage converters which generate +10v and -10v supplies from the 5v supply. the family of devices offers a wide variety of high-speed rs-232 transmitter/ receiver combinations to accommodate various applications (see selection table). the HIN206E, hin211e and hin213e feature a low power shutdown mode to conserve energy in battery powered applications. in addition, the hi n213e provides two active receivers in shutdown mode allowing for easy ?wakeup? capability. the drivers feature true ttl/cm os input compatibility, slew rate-limited output, and 300 ? power-off source impedance. the receivers can handle up to 30v input, and have a 3k ? to 7k ? input impedance. the re ceivers also feature hysteresis to greatly improve noise rejection. features ? pb-free plus anneal available (rohs compliant) ? high speed isdn compatible . . . . . . . . . . . . . 230kbits/s ? esd protection for rs-232 i/o pins to 15kv (iec61000) ? meets all rs-232e and v.28 specifications ? requires only 0.1 f or greater exte rnal capacitors ? two receivers active in shutdown mode (hin213e) ? requires only single +5v power supply ? onboard voltage doubler/inverter ? low power consumption (typ) . . . . . . . . . . . . . . . . . 5ma ? low power shutdown function (typ) . . . . . . . . . . . . .1 a ? three-state ttl/cmos receiver outputs ? multiple drivers - 10v output swing for +5v input -300 ? power-off source impedance - output current limiting - ttl/cmos compatible ? multiple receivers - 30v input voltage range -3k ? to 7k ? input impedance - 0.5v hysteresis to improve noise rejection applications ? any system requiring high-speed rs-232 communications port - computer - portable, mainframe, laptop - peripheral - printers and terminals - instrumentation, ups - modems, isdn terminal adaptors selection table part number power supply voltage number of rs-232 drivers number of rs-232 receivers number of 0.1 f external capacitors low power shutdown/ttl three-state number of receivers active in shutdown hin202e +5v 2 2 4 capacitors no/no 0 HIN206E +5v 4 3 4 capacitors yes/yes 0 hin207e +5v 5 3 4 capacitors no/no 0 hin208e +5v 4 4 4 capacitors no/no 0 hin211e +5v 4 5 4 capacitors yes/yes 0 hin213e +5v 4 5 4 capacitors yes/yes 2 hin232e +5v 2 2 4 capacitors no/no 0 data sheet november 4, 2005 caution: these devices are sensitive to electrosta tic discharge; follow proper ic handling procedures. 1-888-intersil or 1-888-468-3774 | intersil (and design) is a registered trademark of intersil americas inc. copyright ? intersil americas inc. 2003-2005. all rights reserved. all other trademarks mentioned are the property of their respective owners.
2 fn4315.16 november 4, 2005 ordering information part no. part marking temp. range (c) package pkg. dwg. # hin202ecb hin202ecb 0 to 70 16 ld soic (w) m16.3 hin202ecb-t hin202ecb 16 ld soic (w) tape and reel m16.3 hin202ecbz (note) 202ecbz 0 to 70 16 ld soic (w) (pb-free) m16.3 hin202ecbz-t (note) 202ecbz 16 ld soic (w) tape and reel (pb-free) m16.3 hin202ecbn hin202ecbn 0 to 70 16 ld soic (n) m16.15 hin202ecbn-t hin202ecbn 16 ld soic (n) tape and reel m16.15 hin202ecbn z (note) 202ecbn z 0 to 70 16 ld soic (n) (pb-free) m16.15 hin202ecbn z-t (note) 202ecbn z 16 ld soic (n) tape and reel (pb-free) m16.15 hin202ecp hin202ecp 0 to 70 16 ld pdip e16.3 hin202ecpz (note) 202ecpz 0 to 70 16 ld pdip* (pb-free) e16.3 hin202eib hin202eib -40 to 85 16 ld soic (w) m16.3 hin202eib-t hin202eib 16 ld soic (w) tape and reel m16.3 hin202eibz (note) 202eibz -40 to 85 16 ld soic (w) (pb-free) m16.3 hin202eibz-t (note) 202eibz 16 ld soic (w) tape and reel (pb-free) m16.3 hin202eibn hin202eibn -40 to 85 16 ld soic (n) m16.15 hin202eibn-t hin202eibn 16 ld soic (n) tape and reel m16.15 hin202eibn z (note) 202eibn z -40 to 85 16 ld soic (n) (pb-free) m16.15 hin202eibn z-t (note) 202eibn z 16 ld soic (n) tape and reel (pb-free) m16.15 HIN206Ecb HIN206Ecb 0 to 70 24 ld soic m24.3 HIN206Ecb-t HIN206Ecb 24 ld soic tape and reel m24.3 HIN206Ecbz (note) HIN206Ecbz 0 to 70 24 ld soic (pb-free) m24.3 HIN206Ecbz-t (note) HIN206Ecbz 24 ld soic tape and reel (pb-free) m24.3 HIN206Eia HIN206Eia -40 to 85 24 ld ssop m24.209 HIN206Eiaz (note) HIN206Eiaz -40 to 85 24 ld ssop (pb-free) m24.209 HIN206Eiaz-t (note) HIN206Eiaz 24 ld ssop tape and reel (pb-free) m24.209 HIN206Eiaza (note) HIN206Eiaz -40 to 85 24 ld ssop (pb-free) m24.209 HIN206Eiaza-t (note) HIN206Eiaz 24 ld ssop tape and reel (pb-free) m24.209 hin207eca-t hin207eca 24 ld ssop tape and reel m24.209 hin207ecaz (note) hin207ecaz 0 to 70 24 ld ssop (pb-free) m24.209 hin207ecaz-t (note) hin207ecaz 24 ld ssop tape and reel (pb-free) m24.209 hin207ecb hin207ecb 0 to 70 24 ld soic m24.3 hin207ecb-t hin207ecb 24 ld soic tape and reel m24.3 hin207ecbz (note) hin207ecbz 0 to 70 24 ld soic (pb-free) m24.3 hin207ecbz-t (note) hin207ecbz 24 ld soic tape and reel ( pb-free) m24.3 hin207eia hin207eia -40 to 85 24 ld ssop m24.209 hin207eiaz (note) hin207eiaz -40 to 85 24 ld ssop (pb-free) m24.209 hin207eiaz-t (note) hin207eiaz 24 ld ssop tape and reel (pb-free) m24.209 hin207eib hin207eib -40 to 85 24 ld soic m24.3 hin207eib-t hin207eib 24 ld soic tape and reel m24.3 hin207eibz (note) hin207eibz -40 to 85 24 ld soic (pb-free) m24.3 hin207eibz-t (note) hin207eibz 24 ld soic tape and reel (pb-free) m24.3 hin208eca hin208eca 0 to 70 24 ld ssop m24.209 hin208eca-t hin208eca 24 ld ssop tape and reel m24.209 hin208ecaz (note) hin208ecaz 0 to 70 24 ld ssop (pb-free) m24.209 hin208ecaz-t (note) hin208ecaz 24 ld ssop tape and reel (pb-free) m24.209 hin208ecaza-t (note) hin208ecaz 24 ld ssop tape and reel (pb-free) m24.209 hin208ecb hin208ecb 0 to 70 24 ld soic m24.3 hin208ecb-t hin208ecb 24 ld soic tape and reel m24.3 hin208ecbz (note) hin208ecbz 0 to 70 24 ld soic (pb-free) m24.3 hin208ecbz-t (note) hin208ecbz 24 ld soic tape and reel (pb-free) m24.3 hin208eia hin208eia -40 to 85 24 ld ssop m24.209 hin208eia-t hin208eia 24 ld ssop tape and reel m24.209 ordering information (continued) part no. part marking temp. range (c) package pkg. dwg. # hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
3 fn4315.16 november 4, 2005 hin208eiaz (note) hin208eiaz -40 to 85 24 ld ssop (pb-free) m24.209 hin208eiaz-t (note) hin208eiaz 24 ld ssop tape and reel (pb-free) m24.209 hin208eib hin208eib -40 to 85 24 ld soic m24.3 hin208eibz (note) hin208eibz -40 to 85 24 ld soic (pb-free) m24.3 hin211eca hin211eca 0 to 70 28 ld ssop m28.209 hin211eca-t hin211eca 28 ld ssop tape and reel m28.209 hin211ecaz (note) hin211ecaz 0 to 70 28 ld ssop (pb-free) m28.209 hin211ecaz-t (note) hin211ecaz 28 ld ssop tape and reel (pb-free) m28.209 hin211ecb hin211ecb 0 to 70 28 ld soic m28.3 hin211ecbz (note) hin211ecbz 0 to 70 28 ld soic (pb-free) m28.3 hin211ecbz-t (note) hin211ecbz 28 ld soic tape and reel (pb-free) m28.3 hin211eia hin211eia -40 to 85 28 ld ssop m28.209 hin211eia-t hin211eia 28 ld ssop tape and reel m28.209 hin211eiaz (note) hin211eiaz -40 to 85 28 ld ssop (pb-free) m28.209 hin211eiaz-t (note) hin211eiaz 28 ld ssop tape and reel (pb-free) m28.209 hin211eib hin211eib -40 to 85 28 ld soic m28.3 hin211eibz (note) hin211eibz -40 to 85 28 ld soic (pb-free) m28.3 hin213eca hin213eca 0 to 70 28 ld ssop m28.209 hin213eca-t hin213eca 28 ld ssop tape and reel m28.209 hin213ecaz (note) hin213ecaz 0 to 70 28 ld ssop (pb-free) m28.209 hin213ecaz-t (note) hin213ecaz 28 ld ssop tape and reel (pb-free) m28.209 hin213eia hin213eia -40 to 85 28 ld ssop m28.209 hin213eia-t hin213eia 28 ld ssop tape and reel m28.209 hin213eiaz (note) hin213eiaz -40 to 85 28 ld ssop (pb-free) m28.209 hin213eiaz-t (note) hin213eiaz 28 ld ssop tape and reel (pb-free) m28.209 hin213eib hin213eib -40 to 85 28 ld soic m28.3 hin213eibz (note) hin213eibz -40 to 85 28 ld soic (pb-free) m28.3 ordering information (continued) part no. part marking temp. range (c) package pkg. dwg. # hin232eca hin232eca 0 to 70 16 ld ssop m16.209 hin232eca-t hin232eca 16 ld ssop tape and reel m16.209 hin232ecaz-t (note) hin232ecaz 16 ld ssop tape and reel (pb-free) m16.209 hin232ecb hin232ecb 0 to 70 16 ld soic (w) m16.3 hin232ecb-t hin232ecb 16 ld soic (w) tape and reel m16.3 hin232ecbn hin232ecbn 0 to 70 16 ld soic (n) m16.15 hin232ecbn-t hin232ecbn 16 ld soic (n) tape and reel m16.15 hin232ecbnz (note) 232ecbnz 0 to 70 16 ld soic (n) (pb-free) m16.15 hin232ecbnz-t (note) 232ecbnz 16 ld soic (n) tape and reel (pb-free) m16.15 hin232ecbz (note) 232ecbz 0 to 70 16 ld soic (w) (pb-free) m16.3 hin232ecbz-t (note) 232ecbz 16 ld soic (w) tape and reel (pb-free) m16.3 hin232ecp hin232ecp 0 to 70 16 ld pdip e16.3 hin232ecpz (note) hin232ecpz 0 to 70 16 ld pdip* (pb-free) e16.3 hin232eibn hin232eibn -40 to 85 16 ld soic (n) m16.15 hin232eibn-t hin232eibn 16 ld soic (n) tape and reel m16.15 hin232eibnz (note) 232eibnz -40 to 85 16 ld soic (n) (pb-free) m16.15 hin232eibnz-t (note) 232eibnz 16 ld soic (n) tape and reel (pb-free) m16.15 hin232eiv hin232eiv -40 to 85 16 ld tssop m16.173 hin232eiv-t hin232eiv 16 ld tssop tape and reel m16.173 hin232eivz (note) 232eivz -40 to 85 16 ld tssop (pb-free) m16.173 hin232eivz-t (note) 232eivz 16 ld tssop tape and reel (pb-free) m16.173 *pb-free pdips can be used for through hole wave solder processing only. they are not intended for us e in reflow solder processing applications. note: intersil pb-free plus anneal products employ special pb-free material sets; molding compounds /die attach materials and 100% matte tin plate termination finish, which are rohs compliant and compatible with both snpb and pb-free soldering operations. intersil pb-free products are msl classi fied at pb-free peak reflow temperatures that meet or exceed the pb-free requirements of ipc/jedec j std-020. ordering information (continued) part no. part marking temp. range (c) package pkg. dwg. # hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
4 fn4315.16 november 4, 2005 pinouts hin202e (pdip, soic) top view HIN206E (soic, ssop) top view 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd v- t3 out t1 out t2 out r1 in r1 out t2 in t1 in gnd v cc c1+ v+ c1- t4 out r2 out sd en t4 in r3 out v- c2- c2+ r2 in t3 in r3 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 v cc +5v 2 v+ 16 t1 out t2 out t1 in t2 in t1 t2 11 10 14 7 +5v 400k ? +5v 400k ? r1 out r1 in r1 13 12 5k ? r2 out r2 in r2 8 9 5k ? +10v to -10v voltage inverter 0.1 f 6 v- c2+ c2- + 0.1 f 4 5 +5v to 10v voltage inverter c1+ c1- + 0.1 f 1 3 + 0.1 f + gnd 15 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 0.1 f + 0.1 f + 0.1 f 7 6 2 3 18 1 19 24 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 0.1 f 13 14 r1 out r1 in r1 4 5 5k ? r2 out r2 in r2 23 22 5k ? r3 out r3 in r3 16 17 5k ? en 20 21 sd gnd 8 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
5 fn4315.16 november 4, 2005 hin207e (soic, ssop) top view hin208e (soic, ssop) top view pinouts (continued) t3 out t1 out t2 out r1 in r1 out t2 in t1 in gnd v cc c1+ v+ c1- t4 out r2 out t5 in t5 out t4 in r3 out v- c2- c2+ r2 in t3 in r3 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 t2 out t1 out r2 in r2 out t1 in r1 out r1 in gnd v cc c1+ v+ c1- t3 out r3 out t4 in t4 out t3 in r4 out v- c2- c2+ r3 in t2 in r4 in 1 2 3 4 5 6 7 8 9 10 11 12 16 17 18 19 20 21 22 23 24 15 14 13 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 0.1 f + 0.1 f + 0.1 f 7 6 2 3 18 1 19 24 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 0.1 f 13 14 r1 out r1 in r1 4 5 5k ? r2 out r2 in r2 23 22 5k ? r3 out r3 in r3 16 17 5k ? t5 out t5 in t5 21 20 +5v 400k ? gnd 8 9 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t4 out t4 in t1 in t2 in t3 in t1 t2 t3 t4 +5v + 0.1 f + 0.1 f + 0.1 f 5 18 2 1 19 24 21 20 10 12 11 15 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? +5v 400k ? + 0.1 f 13 14 r1 out r1 in r1 7 6 5k ? r2 out r2 in r2 3 4 5k ? r3 out r3 in r3 23 22 5k ? r4 out r4 in r4 16 17 5k ? gnd 8 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
6 fn4315.16 november 4, 2005 hin211e (soic, ssop) top view hin213e (soic, ssop) top view note: r4 and r5 active in shutdown. pinouts (continued) t3 out t1 out t2 out r2 in r2 out t2 in t1 in r1 out r1 in gnd v cc c1+ v+ c1- t4 out r3 out sd en r4 in t4 in r5 out r5 in v- c2- c2+ r3 in r4 out t3 in 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 t3 out t1 out t2 out r2 in r2 out t2 in t1 in r1 out r1 in gnd v cc c1+ v+ c1- t4 out r3 out sd en r4 in t4 in r5 out r5 in v- c2- c2+ r3 in r4 out t3 in 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 11 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t1 in t2 in t3 in t1 t2 t3 +5v + 0.1 f + 0.1 f + 0.1 f 7 6 2 3 20 1 12 14 13 17 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? + 0.1 f 15 16 r1 out r1 in r1 9 5k ? r2 out r2 in r2 4 5 5k ? r3 out r3 in r3 27 26 5k ? r4 out r4 in r4 23 22 5k ? r5 out r5 in r5 18 19 5k ? en 24 8 t4 out t4 in t4 21 28 +5v 400k ? sd 25 gnd 10 11 v cc +5v to 10v voltage doubler +10v to -10v voltage inverter t1 out t2 out t3 out t1 in t2 in t3 in t1 t2 t3 +5v + 0.1 f + 0.1 f + 0.1 f 7 6 2 3 20 1 12 14 13 17 v+ v- c1+ c1- c2+ c2- +5v 400k ? +5v 400k ? +5v 400k ? + 0.1 f 15 16 r1 out r1 in r1 9 5k ? r2 out r2 in r2 4 5 5k ? r3 out r3 in r3 27 26 5k ? r4 out r4 in r4 23 22 5k ? r5 out r5 in r5 18 19 5k ? en 24 8 t4 out t4 in t4 21 28 +5v 400k ? 25 sd gnd 10 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
7 fn4315.16 november 4, 2005 hin232e (pdip, soic, ssop, tssop) top view pin descriptions pin function v cc power supply input 5v 10%, (5v 5% hin207e). v+ internally generated posit ive supply (+10v nominal). v- internally generated negative supply (-10v nominal). gnd ground lead. connect to 0v. c1+ external capacitor (+ termi nal) is connected to this lead. c1- external capacitor (- terminal) is connected to this lead. c2+ external capacitor (+ termi nal) is connected to this lead. c2- external capacitor (- terminal) is connected to this lead. t in transmitter inputs. these leads accept ttl/cmos levels. an internal 400k ? pull-up resistor to v cc is connected to each lead. t out transmitter outputs. these are rs-232 levels (nominally 10v). r in receiver inputs. these inputs accept rs-232 input levels. an internal 5k ? pull-down resistor to gnd is connected to each input. r out receiver outputs. these are ttl/cmos levels. en , en receiver enable input. with en = 5v (hin213e en=0v), the receiver outputs are placed in a high impedance state. sd, sd shutdown input. with sd = 5v (hin213e sd = 0v), the charge pump is disabled, the receiver outputs are in a high impedance state (except r4 and r5 of hin213e) and the transmitters are shut off. nc no connect. no connections are made to these leads. pinouts (continued) 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd v- v cc +5v 2 v+ 16 t1 out t2 out t1 in t2 in t1 t2 11 10 14 7 +5v 400k ? +5v 400k ? r1 out r1 in r1 13 12 5k ? r2 out r2 in r2 8 9 5k ? +10v to -10v voltage inverter 0.1 f 6 v- c2+ c2- + 0.1 f 4 5 +5v to 10v voltage inverter c1+ c1- + 0.1 f 1 3 + 0.1 f + gnd 15 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
8 fn4315.16 november 4, 2005 absolute maximum rati ngs thermal information v cc to ground. . . . . . . . . . . . . . . . . . . . . . (gnd -0.3v) < v cc < 6v v+ to ground . . . . . . . . . . . . . . . . . . . . . . . . (v cc -0.3v) < v+ < 12v v- to ground . . . . . . . . . . . . . . . . . . . . . . .-12v < v- < (gnd +0.3v) input voltages t in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3v < v in < (v+ +0.3v) r in . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30v output voltages t out . . . . . . . . . . . . . . . . . . . .(v- -0.3v) < v txout < (v+ +0.3v) r out . . . . . . . . . . . . . . . . . (gnd -0.3v) < v rxout < (v+ +0.3v) short circuit duration t out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous r out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . continuous esd classification . . . . . . . . . . . . . . . . . . . . see specification table operating conditions temperature range hin2xxecx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0c to 70c hin2xxeix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40c to 85c thermal resistance (typical, note 1) ja (c/w) 16 ld soic (n) package . . . . . . . . . . . . . . . . . . . . . 110 16 ld soic (w) package. . . . . . . . . . . . . . . . . . . . . 100 16 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 155 16 ld tssop package . . . . . . . . . . . . . . . . . . . . . . 145 16 ld pdip package* . . . . . . . . . . . . . . . . . . . . . . . 90 24 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 75 24 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 135 28 ld soic package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 ld ssop package . . . . . . . . . . . . . . . . . . . . . . . 100 maximum junction temperature (plastic package) . . . . . . . . 150c maximum storage temperature range . . . . . . . . . . -65c to 150c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300c (soic and ssop - lead tips only) *pb-free pdips can be used for through hole wave solder processing only. they are not intended for use in reflow solder processing applications. caution: stresses above those listed in ?abs olute maximum ratings? may cause permanent dam age to the device. this is a stress o nly rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. note: 1. ja is measured with the component mount ed on an evaluation pc board in free air. electrical specifications test conditions: v cc = +5v 10%, (v cc = +5v 5% hin207e); c1-c4 = 0.1 f; t a = operating temperature range parameter test conditions min typ max units supply currents power supply current, i cc no load, t a = 25c hin202e - 8 15 ma HIN206E - hin208e, hin211e, hin213e -1120ma hin232e - 5 10 ma shutdown supply current, i cc (sd) t a = 25c HIN206E, hin211e - 1 10 a hin213e - 15 50 a logic and transmitter inputs, receiver outputs input logic low, v ll t in , en , sd, en, sd --0.8v input logic high, v lh t in 2.0 - - v en , sd, en, sd 2.4 - - v transmitter input pullup current, i p t in = 0v - 15 200 a ttl/cmos receiver output voltage low, v ol i out = 1.6ma (hin202e, hin232e, i out = 3.2ma) - 0.1 0.4 v ttl/cmos receiver output voltage high, v oh i out = -1ma 3.5 4.6 - v ttl/cmos receiver output leakage en = v cc , en = 0, 0v < r out < v cc -0.5 10 a receiver inputs rs-232 input voltage range, v in -30 - +30 v receiver input impedance, r in t a = 25c, v in = 3v 3.0 5.0 7.0 k ? receiver input low threshold, v in (h-l) v cc = 5v, t a = 25c active mode - 1.2 - v shutdown mode hin213e r4 and r5 - 1.5 - v receiver input high threshold, v in (l-h) v cc = 5v, t a = 25c active mode - 1.7 2.4 v shutdown mode hin213e r4 and r5 - 1.5 2.4 v receiver input hysteresis, v hyst v cc = 5v, no hysteresis in shutdown mode 0.2 0.5 1.0 v hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
9 fn4315.16 november 4, 2005 timing characteristics output enable time, t en HIN206E, hin211e, hin213e - 600 - ns output disable time, t dis HIN206E, hin211e, hin213e - 200 - ns transmitter, receiver propagation delay, t pd hin213e sd = 0v, r4, r5 - 4.0 40 s hin213e sd = v cc , r1 - r5 - 0.5 10 s all except hin213e - 0.5 10 s transition region slew rate, sr t r l = 3k ? , c l = 1000pf measured from +3v to -3v or -3v to +3v, 1 transmitter switching (note 2) 32045v/ s transmitter outputs output voltage swing, t out transmitter outputs, 3k ? to ground 5 9 10 v output resistance, t out v cc = v+ = v- = 0v, v out = 2v 300 - - ? rs-232 output short circuit current, i sc t out shorted to gnd - 10 - ma esd performance rs-232 pins (t out , r in ) human body model - 15 - kv iec61000-4-2 contact discharge - 8-kv iec61000-4-2 air gap (note 3) - 15 - kv all other pins human body model - 2-kv notes: 2. guaranteed by design. 3. meets level 4. test circuits (hin232e) figure 1. general test circuit f igure 2. power-off source resistance configuration electrical specifications test conditions: v cc = +5v 10%, (v cc = +5v 5% hin207e); c1-c4 = 0.1 f; t a = operating temperature range (continued) parameter test conditions min typ max units 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- v- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd +4.5v to +5.5v input 3k ? t1 output rs-232 30v input ttl/cmos output ttl/cmos input ttl/cmos input ttl/cmos output + - 0.1 f c3 + - 0.1 f c1 + - 0.1 f c2 + - 0.1 f c4 3k ? output rs-232 30v input t2 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 c1+ v+ c1- c2+ c2- v- r2 in t2 out v cc t1 out r1 in r1 out t1 in t2 in r2 out gnd t2 out t1 out v in = 2v a r out = v in /i hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
10 fn4315.16 november 4, 2005 detailed description the hin2xxe family of high-speed rs-232 transmitters/receivers are powered by a single +5v power supply, feature low power cons umption, and meet all ela rs232c and v.28 specifications. t he circuit is divided into three sections: the charge pump , transmitter, and receiver. charge pump an equivalent circuit of the charge pump is illustrated in figure 3. the charge pump co ntains two sections: the voltage doubler and the voltage inverter. each section is driven by a two phase, internally generated clock to generate +10v and -10v. the nominal clock frequency is 125khz. during phase one of the clock, capacitor c1 is charged to v cc . during phase two, the voltage on c1 is added to v cc , producing a signal across c3 equal to twice v cc . during phase two, c2 is also charged to 2v cc , and then during phase one, it is inverted with respect to ground to produce a signal across c4 equal to -2v cc . the charge pump accepts input voltages up to 5.5v. the output impedance of the voltage do ubler section (v+) is approximately 200 ? , and the output impedance of the voltage inverter section (v-) is approximately 450 ? . a typical application uses 0.1 f capacitors for c1-c4, however, the value is not critical. increasing the values of c1 and c2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, c3 and c4, lowers the ripple on the v+ and v- supplies. during shutdown mode (HIN206E, hin211e and hin213e) the charge pump is turned off, v+ is pulled down to v cc , v- is pulled up to gnd, and the supply current is reduced to less than 10 a. the transmitter output s are disabled and the receiver outputs (except for hin213e, r4 and r5) are placed in the high impedance state. transmitters the transmitters are ttl/cmos compatible inverters which translate the inputs to rs- 232 outputs. the input logic threshold is about 26% of v cc , or 1.3v for v cc = 5v. a logic 1 at the input results in a vo ltage of between -5v and v- at the output, and a logic 0 results in a voltage between +5v and (v+ -0.6v). each transmitter input has an internal 400k ? pullup resistor so any unused input can be left unconnected and its output remains in its low state. the output voltage swing meets the rs-232 c specifications of 5v minimum with the worst case conditions of: all transmitters driving 3k ? minimum load impedance, v cc = 4.5v, and maximum allowable operating temperature. the transmitters have an internally limited output slew rate which is less than 30v/ s. the outputs are short circuit protected and can be shorted to ground indefinitely. the powered down output impedance is a minimum of 300 ? with 2v applied to the outputs and v cc = 0v. receivers the receiver inputs accept up to 30v while presenting the required 3k ? to 7k ? input impedance even if the power is off (v cc = 0v). the receivers have a typical input threshold of 1.3v which is within the 3v limits, known as the transition region, of the rs-232 specific ations. the receiver output is 0v to v cc . the output will be low whenever the input is greater than 2.4v and high whenever the input is floating or driven between +0.8v and -30v . the receivers feature 0.5v hysteresis (except during s hutdown) to improve noise rejection. the receiver enable line en , (en on hin213e) when unasserted, disables the receiver outputs, placing them in the high impedance mode. the receiver outputs are also placed in the high impe dance state when in shutdown mode (except hin213e r4 and r5). + - c1 + - c3 + - c2 + - c4 s1 s2 s5 s6 s3 s4 s7 s8 v cc gnd rc oscillator v cc gnd v+ = 2v cc gnd v - = - (v+) c1+ c1 - c2 - c2+ voltage inverter voltage doubler figure 3. charge pump t out v- < v tout < v+ 300 ? 400k ? t xin gnd < t xin < v cc v- v+ v cc figure 4. transmitter hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
11 fn4315.16 november 4, 2005 hin213e operation in shutdown the hin213e features two re ceivers, r4 and r5, which remain active in shutdown mode. during normal operation the receivers propagation delay is typically 0.5 s. this propagation delay may increase slightly during shutdown. when entering shut down mode, receivers r4 and r5 are not valid for 80 s after sd = v il . when exiting shutdown mode, all receiver outputs will be invalid until the charge pump circuitry reaches normal operating voltage. this is typically less than 2ms when using 0.1 f capacitors. application information the hin2xxe may be used for all rs-232 data terminal and communication links. it is partic ularly useful in applications where 12v power supplies are not available for conventional rs-232 interface circuits. the applications presented represent typical interface configurations. a simple duplex rs-232 port with cts/rts handshaking is illustrated in figure 7. fixed output signals such as dtr (data terminal ready) and dsrs (data signaling rate select) is generated by driving them through a 5k ? resistor connected to v+. in applications requiring four rs-232 inputs and outputs (figure 8), note that each circuit requires two charge pump capacitors (c1 and c2) but can share common reservoir capacitors (c3 and c4). t he benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of t he charge pump source impedance which effectively increases the outp ut swing of the transmitters. r out gnd < v rout < v cc 5k ? r xin -30v < r xin < +30v gnd v cc figure 5. receiver t in v ol v ol t plh t phl average propagation delay = t phl + t plh 2 or r in t out or r out figure 6. propagation delay definition - + - + - + ctr (20) data terminal ready dsrs (24) data signaling rate rs-232 inputs and outputs td (2) transmit data rts (4) request to send rd (3) receive data cts (5) clear to send signal ground (7) 15 8 13 7 14 16 - + 6 r2 r1 t2 t1 9 12 10 11 4 5 3 1 hin232e c1 0.1 f c2 0.1 f td rts rd cts select +5v inputs outputs ttl/cmos figure 7. simple duplex rs-232 port with cts/rts handshaking hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
12 fn4315.16 november 4, 2005 typical performance curves figure 9. v- supply voltage vs v cc figure 10. v+, v- output voltage vs load - + rs-232 inputs and outputs dtr (20) data terminal ready dsrs (24) data signaling rate select dcd (8) data carrier detect r1 (22) ring indicator signal ground (7) 15 8 13 7 14 2 - + 4 r2 r1 t2 t1 9 12 10 11 3 1 hin232e c1 0.1 f dtr dsrs dcd r1 +5v inputs outputs ttl/cmos - + - + td (2) transmit data rts (4) request to send rd (3) receive data cts (5) clear to send 8 13 7 14 15 r2 r1 t2 t1 9 12 10 11 4 5 3 1 hin232e c1 0.1 f c2 0.1 f td rts rd cts inputs outputs ttl/cmos - + 5 c2 0.1 f 16 c3 0.2 f 6 2 6 v- v+ - + c4 0.2 f 16 v cc v cc figure 8. combining two hin232es for 4 pairs of rs-232 inputs and outputs 12 10 8 6 4 2 0 3.5 4.0 4.5 6.0 v cc v- supply voltage (v) 5.0 5.5 3.0 0.1 f 35 |i load | (ma) v+ (v cc = 4v) v+ (v cc = 5v) v- (v cc = 5v) v- (v cc = 4v) t a = 25c transmitter outputs open circuit 30 25 20 15 10 5 0 supply voltage (|v|) 0 12 10 8 6 4 2 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
13 fn4315.16 november 4, 2005 die characteristics metallization: type: al thickness: 10k ? 1k ? substrate potential gnd passivation: type: nitride over silox nitride thickness: 8k ? silox thickness: 7k ? transistor count: 185 process: cmos metal gate metallization mask layout hin232e pin 1 c1+ pin 2 v+ c1- pin 7 pin 17 v cc pin 3 c2+ pin 4 c2- pin 5 v- pin 6 t2 in pin 11 t1 in pin 12 r1 out pin 13 r1 in pin 14 t1 out pin 15 gnd pin 16 t2 out pin 8 r2 in pin 9 t3 out pin 10 r2 out hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e
14 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e dual-in-line plastic packages (pdip) notes: 1. controlling dimensions: inch. in case of conflict between english and metric dimensions, the in ch dimensions control. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. symbols are defined in the ?mo series symbol list? in section 2.2 of publication no. 95. 4. dimensions a, a1 and l are measured with the package seated in je- dec seating plane gauge gs - 3. 5. d, d1, and e1 dimensions do not include mold flash or protrusions. mold flash or protrusions shal l not exceed 0.010 inch (0.25mm). 6. e and are measured with the leads constrained to be perpendic- ular to datum . 7. e b and e c are measured at the lead tips with the leads unconstrained. e c must be zero or greater. 8. b1 maximum dimensions do not include dambar protrusions. dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. n is the maximum number of terminal positions. 10. corner leads (1, n, n/2 and n/2 + 1) for e8.3, e16.3, e18.3, e28.3, e42.6 will have a b1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). e a -c- c l e e a c e b e c -b- e1 index 12 3 n/2 n area seating base plane plane -c- d1 b1 b e d d1 a a2 l a1 -a- 0.010 (0.25) c a m bs e16.3 (jedec ms-001-bb issue d) 16 lead dual-in-line plastic package symbol inches millimeters notes min max min max a - 0.210 - 5.33 4 a1 0.015 - 0.39 - 4 a2 0.115 0.195 2.93 4.95 - b 0.014 0.022 0.356 0.558 - b1 0.045 0.070 1.15 1.77 8, 10 c 0.008 0.014 0.204 0.355 - d 0.735 0.775 18.66 19.68 5 d1 0.005 - 0.13 - 5 e 0.300 0.325 7.62 8.25 6 e1 0.240 0.280 6.10 7.11 5 e 0.100 bsc 2.54 bsc - e a 0.300 bsc 7.62 bsc 6 e b - 0.430 - 10.92 7 l 0.115 0.150 2.93 3.81 4 n16 169 rev. 0 12/93
15 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m m16.15 (jedec ms-012-ac issue c) 16 lead narrow body small outline plastic package symbol inches millimeters notes min max min max a 0.0532 0.0688 1.35 1.75 - a1 0.0040 0.0098 0.10 0.25 - b 0.013 0.020 0.33 0.51 9 c 0.0075 0.0098 0.19 0.25 - d 0.3859 0.3937 9.80 10.00 3 e 0.1497 0.1574 3.80 4.00 4 e 0.050 bsc 1.27 bsc - h 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 8 0 8 - rev. 1 6/05
16 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e thin shrink small outlin e plastic packages (tssop) notes: 1. these package dimensions are wi thin allowable dimensions of jedec mo-153-ab, issue e. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e1? does not includ e interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.15mm (0.006 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.08mm (0.003 inch) total in excess of ?b? dimension at maximum ma terial condition. minimum space between protrusion and adjacent lead is 0.07mm (0.0027 inch). 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. (angles in degrees) index area e1 d n 123 -b- 0.10(0.004) c a m bs e -a- b m -c- a1 a seating plane 0.10(0.004) c e 0.25(0.010) b m m l 0.25 0.010 gauge plane a2 0.05(0.002) m16.173 16 lead thin shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.043 - 1.10 - a1 0.002 0.006 0.05 0.15 - a2 0.033 0.037 0.85 0.95 - b 0.0075 0.012 0.19 0.30 9 c 0.0035 0.008 0.09 0.20 - d 0.193 0.201 4.90 5.10 3 e1 0.169 0.177 4.30 4.50 4 e 0.026 bsc 0.65 bsc - e 0.246 0.256 6.25 6.50 - l 0.020 0.028 0.50 0.70 6 n16 167 0 o 8 o 0 o 8 o - rev. 1 2/02
17 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e small outline plast ic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate bur rs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interl ead flash or protrusions. interlead flash and protrusions shall not exce ed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimen- sion at maximum material condition. 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m16.209 (jedec mo-150-ac issue b) 16 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.233 0.255 5.90 6.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n16 167 0 8 0 8 - rev. 3 6/05
18 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include inte rlead flash or protrusions. interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 c h 0.25(0.010) b m m m16.3 (jedec ms-013-aa issue c) 16 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.3977 0.4133 10.10 10.50 3 e 0.2914 0.2992 7.40 7.60 4 e 0.050 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n16 167 0 8 0 8 - rev. 1 6/05
19 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e shrink small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dam bar protrusion. allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of ?b? dimen- sion at maximum material condition. 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m24.209 (jedec mo-150-ag issue b) 24 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.312 0.334 7.90 8.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n24 247 0 o 8 o 0 o 8 o - rev. 1 3/95
20 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mold flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. inter- lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional. if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m24.3 (jedec ms-013-ad issue c) 24 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.020 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.5985 0.6141 15.20 15.60 3 e 0.2914 0.2992 7.40 7.60 4 e 0.05 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n24 247 0 o 8 o 0 o 8 o - rev. 0 12/93
21 fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e shrink small outline plastic packages (ssop) notes: 1. symbols are defined in the ?mo seri es symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mo ld flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. dimension ?e? does not include interlead flash or protrusions. interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. the chamfer on the body is optional . if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. dimension ?b? does not include dambar protrusion. allowable dambar protrusion shall be 0.13mm (0 .005 inch) total in excess of ?b? dimension at maximum material condition. 10. controlling dimension: millimete r. converted inch dimensions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) c h 0.25(0.010) b m m 0.25 0.010 gauge plane a2 m28.209 (jedec mo-150-ah issue b) 28 lead shrink small outline plastic package symbol inches millimeters notes min max min max a - 0.078 - 2.00 - a1 0.002 - 0.05 - - a2 0.065 0.072 1.65 1.85 - b 0.009 0.014 0.22 0.38 9 c 0.004 0.009 0.09 0.25 - d 0.390 0.413 9.90 10.50 3 e 0.197 0.220 5.00 5.60 4 e 0.026 bsc 0.65 bsc - h 0.292 0.322 7.40 8.20 - l 0.022 0.037 0.55 0.95 6 n28 287 0 8 0 8 - rev. 2 6/05
22 all intersil u.s. products are manufactured, asse mbled and tested utilizing iso9000 quality systems. intersil corporation?s quality certifications ca n be viewed at www.intersil.com/design/quality intersil products are sold by description only. intersil corpor ation reserves the right to make changes in circuit design, soft ware and/or specifications at any time without notice. accordingly, the reader is cautioned to verify that data sheets are current before placing orders. information furnishe d by intersil is believed to be accurate and reliable. however, no responsibility is assumed by intersil or its subsidiaries for its use; nor for any infringements of paten ts or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of intersil or its subsidiari es. for information regarding intersil corporation and its products, see www.intersil.com fn4315.16 november 4, 2005 hin202e, HIN206E, hin207e, hin208 e, hin211e, hin213e, hin232e small outline plast ic packages (soic) notes: 1. symbols are defined in the ?mo series symbol list? in section 2.2 of publication number 95. 2. dimensioning and tolerancing per ansi y14.5m - 1982. 3. dimension ?d? does not include mo ld flash, protrusions or gate burrs. mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. dimension ?e? does not include in terlead flash or protrusions. in- terlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. the chamfer on the body is optional . if it is not present, a visual index feature must be located within the crosshatched area. 6. ?l? is the length of terminal for soldering to a substrate. 7. ?n? is the number of terminal positions. 8. terminal numbers are shown for reference only. 9. the lead width ?b?, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. controlling dimension: millimeter. converted inch dimen- sions are not necessarily exact. index area e d n 123 -b- 0.25(0.010) c a m bs e -a- l b m -c- a1 a seating plane 0.10(0.004) h x 45 o c h 0.25(0.010) b m m m28.3 (jedec ms-013-ae issue c ) 28 lead wide body small outline plastic package symbol inches millimeters notes min max min max a 0.0926 0.1043 2.35 2.65 - a1 0.0040 0.0118 0.10 0.30 - b 0.013 0.0200 0.33 0.51 9 c 0.0091 0.0125 0.23 0.32 - d 0.6969 0.7125 17.70 18.10 3 e 0.2914 0.2992 7.40 7.60 4 e 0.05 bsc 1.27 bsc - h 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 l 0.016 0.050 0.40 1.27 6 n28 287 0 o 8 o 0 o 8 o - rev. 0 12/93

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